Vempati, P. : rechercher sur Z-Library

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1

Different population histories of the Mundari- and Mon-Khmer-speaking Austro-Asiatic tribes inferred from the mtDNA 9-bp deletion/insertion polymorphism in Indian populations

Kumarasamy Thangaraj, Vempati Sridhar, Toomas Kivisild, Alla G. Reddy, Gyaneshwer Chaubey, Vijay Kumar Singh, Suminder Kaur, Pooja Agarawal, Amit Rai, Jalaj Gupta, Chandana Basu Mallick, Niraj Kumar,

Journal:

Année:

2006

Langue:

english

Fichier:

PDF, 120 KB

english, 2006

2

The characteristics, experiences and perceptions of homeopaths in New Zealand: results from a national survey of practitioners

Cottingham, Phillip, Adams, Jon, Vempati, Ram, Dunn, Jill, Sibbritt, David

Journal:

Année:

2017

Langue:

english

Fichier:

PDF, 226 KB

english, 2017

3

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Evaluation of Materials for Fan-Out Panel Level Packaging (FOPLP) Applications

Sekhar, Vasarla Nagendra, Rao, Vempati Srinivasa, Yamamoto, Kazunori, Fujinaga, Tetsushi, Jono, Koichi, Matsui, Hiroshi, Yoshiteru, Takaya, Yukio, Horiguchi

Année:

2018

Langue:

english

Fichier:

PDF, 549 KB

english, 2018

4

Effect of inlet swirl on the performance of annular diffusers having the same equivalent cone angle

Singh, S N, Seshadri, V, Saha, K, Vempati, K K, Bharani, S

Journal:

Proceedings of the Institution of Mechanical Engineers Part G Journal of Aerospace Engineering

Année:

2006

Langue:

english

Fichier:

PDF, 604 KB

english, 2006

5

Bed of Nails—100-m-Pitch Wafer-Level Interconnections Process

Vempati, S.R., Tay, A.A.O., Kripesh, V., Seung Wook Yoon

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2008

Langue:

english

Fichier:

PDF, 2.36 MB

english, 2008

6

Generalized state estimation

Alsac, O., Vempati, N., Stott, B., Monticelli, A.

Journal:

IEEE Transactions on Power Systems

Année:

1998

Langue:

english

Fichier:

PDF, 818 KB

english, 1998

7

Orthogonal sparse vector methods

Vempati, N., Slutsker, I.W., Tinney, W.F.

Journal:

IEEE Transactions on Power Systems

Année:

1992

Langue:

english

Fichier:

PDF, 723 KB

english, 1992

8

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

Rao, Vempati Srinivasa, Chong, Chai Tai, Ho, David, Zhi, Ding Mian, Choong, Chong Ser, PS, Sharon Lim, Ismael, Daniel, Liang, Ye Yong

Année:

2016

Langue:

english

Fichier:

PDF, 2.23 MB

english, 2016

9

Simplified Feeder Modeling for Loadflow Calculations

Vempati, N., Shoults, R. R., Chen, M. S., Schwobel, L.

Journal:

IEEE Transactions on Power Systems

Année:

1987

Langue:

english

Fichier:

PDF, 774 KB

english, 1987

10

[IEEE 2013 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE) - Hyderabad, India (2013.07.7-2013.07.10)] 2013 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE) - T-S fuzzy model based Maximum Power Point Tracking control of photovoltaic system

Kumar, Avanish, Vempati, Anurag Sai, Behera, Laxmidhar

Année:

2013

Langue:

english

Fichier:

PDF, 364 KB

english, 2013

11

Sequential bad data analysis in state estimation using orthogonal transformations

Vempati, N., Shoults, R.R.

Journal:

IEEE Transactions on Power Systems

Année:

1991

Langue:

english

Fichier:

PDF, 915 KB

english, 1991

12

Enhancement to Givens rotations for power system state estimation

Vempati, N., Slutsker, I.W., Tinney, W.F.

Journal:

IEEE Transactions on Power Systems

Année:

1991

Langue:

english

Fichier:

PDF, 882 KB

english, 1991

13

A Novel Test Strategy for Fine Pitch Wafer-Level Packaged Devices

Jayabalan, Jayasanker, Rotaru, Mihai Dragos, Rao, Vempati Srinivasa, Kripesh, Vaidyanathan, Iyer, Mahadevan Krishna, Tay, Andrew A. O., Ooi, Ban-Leong, Leong, Mook-Seng

Journal:

IEEE Transactions on Advanced Packaging

Année:

2007

Langue:

english

Fichier:

PDF, 2.71 MB

english, 2007

14

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Reliability Results of 0.8 mil Fine Pitch Copper wire bonding on Immersion Gold Plated Pad for Copper Low-k Devices

Wai, Leong Ching, Zhang, Xiaowu, Kripesh, V., Premachandran, C. S., Chong, S.C., Liu, Ying Ying, Madhukumar, J., Srinivas, Vempati Rao, Thaw, PP, Jong, MJ, Lau, John H., Wang, Sandy, Foo, CK, Thew, ML

Année:

2008

Langue:

english

Fichier:

PDF, 5.84 MB

english, 2008

15

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Fine pitch copper wire bonding on 45nm tech Cu/low-k chip with different bond pad metallurgy

Leong Ching Wai,, Jaafar, Norhanani Binte, Chew, Michelle, Sivakumar,, Gunasekaran,, Kanchet,, Witarsa, David, Tan Juan Boon,, Srinivasa, Vempati Rao, Chai, TC, Alastair,, Woo, Jasmine

Année:

2011

Langue:

english

Fichier:

PDF, 1.29 MB

english, 2011

16

The characteristics, experiences and perceptions of naturopathic and herbal medicine practitioners: results from a national survey in New Zealand

Cottingham, Phillip, Adams, Jon, Vempati, Ram, Dunn, Jill, Sibbritt, David

Journal:

BMC Complementary and Alternative Medicine

Année:

2015

Langue:

english

Fichier:

PDF, 592 KB

english, 2015

17

Panel Warpage of Fan-Out Panel Level Packaging using RDL-First Technology

Che, Fa Xing, Yamamoto, Kazunori, Rao, Vempati Srinivasa, Sekhar, Vasarla Nagendra

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2019

Langue:

english

Fichier:

PDF, 925 KB

english, 2019

18

An application of genetic algorithms for flow shop problems

Chuen-Lung Chen, Venkateswara S. Vempati, Nasser Aljaber

Journal:

European Journal of Operational Research

Année:

1995

Langue:

english

Fichier:

PDF, 555 KB

english, 1995

19

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package

Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xi

Journal:

Microelectronics Reliability

Année:

2010

Langue:

english

Fichier:

PDF, 805 KB

english, 2010

20

Neutrino mass constraints on R violation and HERA anomaly

Anjan S Joshipura, V Ravindran, Sudhir K Vempati

Journal:

Physics Letters B

Année:

1999

Langue:

english

Fichier:

PDF, 135 KB

english, 1999

21

Different population histories of the Mundari- and Mon-Khmer-speaking Austro-Asiatic tribes inferred from the mtDNA 9-bp deletion/insertion polymorphism in Indian populations

Kumarasamy Thangaraj, Vempati Sridhar, Toomas Kivisild, Alla G. Reddy, Gyaneshwer Chaubey, Vijay Kumar Singh, Suminder Kaur, Pooja Agarawal, Amit Rai, Jalaj Gupta, Chandana Basu Mallick, Niraj Kumar,

Journal:

Année:

2005

Langue:

english

Fichier:

PDF, 561 KB

english, 2005

22

Combined buoyancy and viscous effects in liquid–liquid flows in a vertical pipe

Bhadraiah Vempati, Mahesh V. Panchagnula, Alparslan Öztekin, Sudhakar Neti

Journal:

Année:

2010

Langue:

english

Fichier:

PDF, 505 KB

english, 2010

23

Stability of two-layered fluid flows in an inclined channel

Bhadraiah Vempati, Alparslan Oztekin, Sudhakar Neti

Journal:

Année:

2010

Langue:

english

Fichier:

PDF, 364 KB

english, 2010

24

Soret and Dufour effects on unsteady MHD flow past an infinite vertical porous plate with thermal radiation

S. R. Vempati, A. B. Laxmi-Narayana-Gari

Journal:

Applied Mathematics and Mechanics

Année:

2010

Langue:

english

Fichier:

PDF, 369 KB

english, 2010

25

Chemical and physical effects of sodium lignosulfonate superplasticizer on the hydration of portland cement and solidification/stabilization consequences

M. Yousuf, A. Mollah, Padmavathy Palta, Thomas R. Hess, Rajan K. Vempati, David L. Cocke

Journal:

Cement and Concrete Research

Année:

1995

Langue:

english

Fichier:

PDF, 889 KB

english, 1995

26

A TRA Bridge Technique for In-Circuit Impedance Measurement

Rahman, Mahfoozur, Ahmed, Muslim T., Murti, Vempati G. K.

Journal:

IEEE Transactions on Instrumentation and Measurement

Année:

1984

Langue:

english

Fichier:

PDF, 1.03 MB

english, 1984

27

Solution-based synthesis of cobalt-doped ZnO thin films

Sesha Vempati, Amitha Shetty, P. Dawson, K.K. Nanda, S.B. Krupanidhi

Journal:

Thin Solid Films

Année:

2012

Langue:

english

Fichier:

PDF, 1.29 MB

english, 2012

28

High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)

Ying Ying Lim, Xianghua Xiao, Vempati, S.R., Su, N., Kumar, A., Sharma, G., Teck Guan Lim, Vaidyanathan, K., Jinglin Shi, Lau, J.H., Shiguo Liu

Journal:

IEEE Transactions on Advanced Packaging

Année:

2010

Langue:

english

Fichier:

PDF, 1.91 MB

english, 2010

29

Low-frequency noise in UHV/CVD epitaxial Si and SiGe bipolar transistors

Vempati, L.S., Cressler, J.D., Babcock, J.A., Jaeger, R.C., Harame, D.L.

Journal:

IEEE Journal of Solid-State Circuits

Année:

1996

Langue:

english

Fichier:

PDF, 1.17 MB

english, 1996

30

The rights to fight price volatility

Alsac, O., Bright, J.M., Brignone, S., Prais, M., Silva, C., Stott, B., Vempati, N.

Journal:

IEEE Power and Energy Magazine

Année:

2004

Langue:

english

Fichier:

PDF, 2.25 MB

english, 2004

31

Sensitive Surface States and their Passivation Mechanism in CdS Quantum Dots

Vempati, Sesha, Ertas, Yelda, Uyar, Tamer

Journal:

The Journal of Physical Chemistry C

Année:

2013

Langue:

english

Fichier:

PDF, 472 KB

english, 2013

32

[IEEE 2012 International Conference on Emerging Trends in Electrical Engineering and Energy Management (ICETEEEM) - Chennai, Tamil Nadu, India (2012.12.13-2012.12.15)] 2012 International Conference on Emerging Trends in Electrical Engineering and Energy Management (ICETEEEM) - Design and Simulation of single-stage single-switch electronic ballast with SEPIC topology for fluorescent lamps

Reddy, Vempati Venkateaswar, Paleti, Srikanth

Année:

2012

Langue:

english

Fichier:

PDF, 2.16 MB

english, 2012

33

Systemic review on drug related hospital admissions – A pubmed based search

Nivya, Kolli, Sri Sai Kiran, Vempati, Ragoo, Nandita, Jayaprakash, B., Sonal Sekhar, M.

Journal:

Saudi Pharmaceutical Journal

Année:

2015

Langue:

english

Fichier:

PDF, 474 KB

english, 2015

34

IVIG immunotherapy protects against synaptic dysfunction in Alzheimer's disease through complement anaphylatoxin C5a-mediated AMPA-CREB-C/EBP signaling pathway

Gong, Bing, Pan, Yong, Zhao, Wei, Knable, Lindsay, Vempati, Prashant, Begum, Shimul, Ho, Lap, Wang, Jun, Yemul, Shrishailam, Barnum, Scott, Bilski, Amanda, Gong, Ben Y., Pasinetti, Giulio M.

Journal:

Molecular Immunology

Année:

2013

Langue:

english

Fichier:

PDF, 2.60 MB

english, 2013

35

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Development of 3D silicon module with TSV for system in packaging

Khan, Navas, Vempati Srinivasa Rao,, Lim, Samule, Ho Soon We,, Lee, Vincent, Zhang Xiao Wu,, Yang Rui,, Liao Ebin,, Ranganathan,, Chai, T.C., Kripesh, V., Lau, John

Année:

2008

Langue:

english

Fichier:

PDF, 1.11 MB

english, 2008

36

Role of zinc interstitials and oxygen vacancies of ZnO in photocatalysis: a bottom-up approach to control defect density

Kayaci, Fatma, Vempati, Sesha, Donmez, Inci, Biyikli, Necmi, Uyar, Tamer

Journal:

Année:

2014

Langue:

english

Fichier:

PDF, 1.41 MB

english, 2014

37

Fluorescence from graphene oxide and the influence of ionic, π–π interactions and heterointerfaces: electron or energy transfer dynamics

Vempati, Sesha, Uyar, Tamer

Journal:

Physical Chemistry Chemical Physics

Année:

2014

Langue:

english

Fichier:

PDF, 4.14 MB

english, 2014

38

Reliable Crowdsourcing for Multi-Class Labeling Using Coding Theory

Vempaty, Aditya, Varshney, Lav R., Varshney, Pramod K.

Journal:

IEEE Journal of Selected Topics in Signal Processing

Année:

2014

Langue:

english

Fichier:

PDF, 2.78 MB

english, 2014

39

Heterogeneous Three-Layer TSV Chip Stacking Assembly With Moldable Underfill

Pei-Siang, Sharon Lim, Che, Fa Xing, Choong, Chong Ser, Rong, Michelle Chew Bi, Sekhar, Vasarla Nagendra, Rao, Vempati Srinivasa, Chong, Chai Tai

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2013

Langue:

english

Fichier:

PDF, 3.09 MB

english, 2013

40

Solutions Strategies for Die Shift Problem in Wafer Level Compression Molding

Sharma, Gaurav, Kumar, Aditya, Rao, Vempati Srinivas, Ho, Soon Wee, Kripesh, Vaidyanathan

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2011

Langue:

english

Fichier:

PDF, 1.82 MB

english, 2011

41

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Challenges and optimization of 2nd bond process for reliable QFN packages

Jaafar, Norhanani Binte, Leong Ching, Eva Wai, Bi-Rong, Michelle Chew, Rao, Vempati Srinivasa, Minwoo, Daniel Rhee

Année:

2013

Langue:

english

Fichier:

PDF, 665 KB

english, 2013

42

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer

Ong, Yue Ying, Chai, Tai Chong, Yu, Daquan, Thew, Meei Leng, Myo, Eipa, Wai, Leong Ching, Jong, Ming Chinq, Rao, Vempati Srinivasa, Su, Nandar, Zhang, Xiaowu, Damaruganath, Pinjala

Année:

2009

Langue:

english

Fichier:

PDF, 1.91 MB

english, 2009

43

Development of Package-on-Package Using Embedded Wafer-Level Package Approach

Chong, Ser Choong, Wee, David Ho Soon, Rao, Vempati Srinivasa, Vasarla, Nagendra Sekhar

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2013

Langue:

english

Fichier:

PDF, 1.97 MB

english, 2013

44

On Quantizer Design for Distributed Bayesian Estimation in Sensor Networks

Vempaty, Aditya, He, Hao, Chen, Biao, Varshney, Pramod K.

Journal:

IEEE Transactions on Signal Processing

Année:

2014

Langue:

english

Fichier:

PDF, 2.27 MB

english, 2014

45

Energy-Aware Sensor Selection in Field Reconstruction

Liu, Sijia, Vempaty, Aditya, Fardad, Makan, Masazade, Engin, Varshney, Pramod K.

Journal:

IEEE Signal Processing Letters

Année:

2014

Langue:

english

Fichier:

PDF, 1.08 MB

english, 2014

46

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Evaluation of ultra thick photo resist for high aspect ratio bumping applications

Fernandez, D.M., Rao, Vempati Srinivsa, Soon Wee Ho David,, Wai Hong See Toh Justin,, Li Yan Siow,

Année:

2011

Langue:

english

Fichier:

PDF, 2.91 MB

english, 2011

47

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - A novel method to predict die shift during compression molding in embedded wafer level package

Chee Houe Khong,, Kumar, Aditya, Xiaowu Zhang,, Sharma, Gaurav, Vempati, Srinivasa Rao, Vaidyanathan, Kripesh, Lau, John Hon-Shing, Dim-Lee Kwong,

Année:

2009

Langue:

english

Fichier:

PDF, 2.55 MB

english, 2009

48

Sneutrino vacuum expectation values and neutrino anomalies through trilinear R -parity violation

Joshipura, Anjan S., Vempati, Sudhir K.

Journal:

Physical Review D

Année:

1999

Langue:

english

Fichier:

PDF, 65 KB

english, 1999

49

Distributed Inference with Byzantine Data: State-of-the-Art Review on Data Falsification Attacks

Vempaty, Aditya, Tong, Lang, Varshney, Pramod K.

Journal:

IEEE Signal Processing Magazine

Année:

2013

Langue:

english

Fichier:

PDF, 1.76 MB

english, 2013

50

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Development of negative profile of dry film resist for metal lift off process

Chew, Michelle, Ho, Soon Wee, Su, Nandar, Liao, Ebin, Rao, Vempati Srinivas, Premachandran, C S, Kumar, Rakesh, Damaruganath, Pinjala

Année:

2009

Langue:

english

Fichier:

PDF, 401 KB

english, 2009